DGK-LDPE DD4-5 Conductive PE Data Sheet: 10³-10⁵ Ω Surface Resistance

A data-sheet interpretation of DGK-LDPE DD4-5 conductive LDPE, connecting 10³-10⁵ Ω surface resistance, carbon black network design, film processing and ESD packaging validation.

A data-sheet interpretation of DGK-LDPE DD4-5 conductive LDPE, connecting 10³-10⁵ Ω surface resistance, carbon black network design, film processing and ESD packaging validation.

Related DEYU references: DGK-LDPE DD4-5 product page and conductive LDPE / PE application guide.

This product page addresses packaging engineers, film extruders, and procurement specialists who need a high-conductivity LDPE compound for ESD packaging, films, bags, and thermoformed trays. The page establishes DGK-LDPE DD4-5 as a reliable conductive PE achieving surface resistivity of 10³–10⁵ Ω — suitable for electronics packaging and static-sensitive industrial applications.

Product Overview

DGK-LDPE DD4-5 is DEYU's high-conductivity low-density polyethylene (LDPE) compound, engineered for extrusion and injection molding applications requiring reliable static dissipation. With surface resistivity in the 10³–10⁵ Ω range, this material bridges the gap between conventional anti-static LDPE (10⁹–10¹¹ Ω) and ultra-conductive grades, delivering consistent ESD protection for packaging, films, and industrial components.

What 10³–10⁵ Ω surface resistivity means in context:

Material TypeTypical Surface ResistivityComparison to DGK-LDPE DD4-5
Standard LDPE (unfilled)>10¹² ΩMillions of times higher
Anti-static LDPE10⁹–10¹¹ Ω10,000–100,000× higher
Dissipative LDPE10⁶–10⁹ Ω10–1,000× higher
DGK-LDPE DD4-510³–10⁵ ΩBaseline
Highly conductive grades10¹–10² ΩComparable

DGK-LDPE DD4-5 achieves surface resistivity in the 10³–10⁵ Ω range — 1–3 orders of magnitude lower than standard dissipative conductive LDPE (10⁶–10⁹ Ω). This ultra-low resistivity enables applications where rapid static charge dissipation is critical for protecting sensitive electronic components.

Key applications:

ESD bags and films for electronic components

Thermoformed ESD trays and blisters

FIBC liners for hazardous powders

Anti-static packaging for semiconductor handling

Cleanroom liners and waste sacks

Conductive extrusion profiles and tubing

Injection-molded ESD containers and component carriers

Key features:

FeatureBenefit
Surface resistivity 10³–10⁵ ΩReliable ESD protection for sensitive components
LDPE base resinExcellent flexibility, chemical resistance, and processability
Extrusion and injection molding compatibleVersatile processing options
Permanent conductivityHumidity-independent performance — no surface migration or wash-out
High elongation (410%)Excellent ductility for film and bag applications
Lightweight (0.91 g/cm³)Cost-effective shipping and handling

Technical Foundation — How DGK-LDPE DD4-5 Achieves Stable Conductivity

1. Conductive Carbon Black Network

DGK-LDPE DD4-5 utilizes a carefully optimized carbon black conductive network dispersed throughout the LDPE matrix. The carbon black particles form a percolated network that provides continuous conductive pathways through the insulating polymer. This network is permanent, humidity-independent, and does not migrate to the surface or wash out over time — unlike ionic antistatic additives that lose effectiveness in low-humidity conditions.

2. LDPE Matrix — The Right Balance

LDPE was selected as the base resin for its unique combination of properties:

PropertyValueAdvantage
Density0.91 g/cm³Lightweight — reduces shipping costs
FlexibilityExcellentSuitable for films, bags, and flexible packaging
Chemical resistanceGoodWithstands cleaning agents and industrial environments
ProcessabilityExcellentCompatible with blown film, cast film, extrusion, and injection molding
Elongation410%High ductility for demanding packaging applications
Referenced existing product image: DGK-LDPE DD4-5 conductive PE pellets for extrusion and molding trials.
Referenced existing product image: DGK-LDPE DD4-5 conductive PE pellets for extrusion and molding trials.

3. Processing Flexibility

DGK-LDPE DD4-5 supports multiple processing methods, making it adaptable to different manufacturing requirements:

Processing MethodSuitabilityTypical Applications
Blown filmExcellentESD bags, liners, films
Cast filmExcellentThin packaging films
ExtrusionExcellentSheets, profiles, tubing
Injection moldingGoodTrays, containers, components

4. Permanent, Humidity-Independent Conductivity

Unlike ionic antistatic coatings or additives that depend on ambient humidity for performance, carbon black-filled conductive LDPE provides permanent, volume-conductive ESD protection that is completely independent of ambient humidity. This is a critical advantage for packaging applications where humidity conditions may vary during storage and transport.

5. Surface Resistivity of 10³–10⁵ Ω

The 10³–10⁵ Ω surface resistivity range provides:

Rapid static dissipation — charges are safely conducted away before accumulating to damaging levels

Dust prevention — reduced electrostatic attraction minimizes dust accumulation on surfaces

ESD protection — protects sensitive electronic components during handling and transport

Grounding capability — provides a low-resistance path to ground for charge dissipation

Product Data

Core Specifications (from Certificate of Analysis):

PropertyValueTest MethodNotes
Product ModelDGK-LDPE DD4-5 (DD4-5A1)
Base ResinLDPE
AppearanceBlack
Density0.91 g/cm³GB/T 1033-1986Lightweight — cost-effective shipping
Surface Resistivity10³–10⁵ ΩGB/T 1401-2002Ultra-low — stable ESD protection
FlammabilityHBUL-94 GB/T 2408-1996
Processing MethodsExtrusion, injection moldingVersatile processing

All listed data are reference values from the test direction stated in the certificate of analysis.

Mechanical Properties:

PropertyValueTest MethodNotes
Tensile Strength18 MPaGB/T 1040-2006
Yield Strength8.7 MPaGB/T 1040-2006
Bending Strength7.4 MPaGB/T 9341-2008
Flexural Modulus360 MPaGB/T 9341-2008Moderate flexibility
Charpy Notched Impact12 kJ/m²GB/T 1043.1-2008Good impact resistance
Izod Notched ImpactNo breakGB/T 1843-2000Exceptional ductility
Elongation at Break410%GB/T 1040-2006Excellent ductility for films and bags

All listed data are reference values from the test direction stated in the certificate of analysis.

Thermal and Flow Properties:

PropertyValueTest MethodNotes
Melt Flow Rate (MFR)4.5 g/10minGB/T 3682-2000Good flow for extrusion and molding
Heat Deflection Temperature95°CGB/T 1633-2000A method — 120°C
Drying Temperature90°CBefore processing
Drying Time4–5 hours
Processing Temperature225–230°CExtrusion, injection molding
Mold Temperature80°CRecommended

All listed data are reference values from the test direction stated in the certificate of analysis.

Application Deep Dive

1. ESD Bags and Films

DGK-LDPE DD4-5 is ideal for manufacturing ESD bags and films for electronic components. The 10³–10⁵ Ω surface resistivity provides rapid static dissipation, protecting sensitive ICs, semiconductors, and electronic assemblies during storage and transport.

Key features for film applications:

High elongation (410%) — excellent tear resistance and durability

Good melt strength — supports blown film processing

Uniform conductivity — consistent ESD protection across the film surface

Light-tight — carbon black blocks light, protecting light-sensitive components

2. Thermoformed ESD Trays and Blisters

For thermoformed trays and blisters, DGK-LDPE DD4-5 offers the right balance of formability and conductivity.

Key features for thermoforming:

Good formability — can be formed into complex shapes

Consistent conductivity — maintains ESD protection after forming

Impact resistance — 12 kJ/m² Charpy impact protects components

Lightweight — reduces shipping costs

3. FIBC Liners and Hazardous Material Packaging

DGK-LDPE DD4-5 is suitable for FIBC liners and packaging for flammable or explosive materials that require static dissipation.

Key features for hazardous material packaging:

Surface resistivity 10³–10⁵ Ω — effective grounding for hazardous materials

Permanent conductivity — does not degrade over time

Chemical resistance — withstands aggressive materials

Moisture protection — barrier properties for sensitive contents

4. Injection-Molded ESD Components

DGK-LDPE DD4-5 can be injection molded into ESD-safe containers, trays, and component carriers.

Key features for injection molding:

Good flow (MFR 4.5 g/10min) — fills complex geometries

No break Izod impact — exceptional toughness

Dimensional stability — consistent part quality

Processing Guidelines

ParameterValueNotes
Drying Temperature90°C
Drying Time4–5 hoursEnsure thorough drying before processing
Processing Temperature225–230°CExtrusion, injection molding
Mold Temperature80°CRecommended

Key Processing Considerations:

ConsiderationImportanceGuidance
Pre-dryingCriticalMoisture can affect surface quality; dry at 90°C for 4–5 hours
Temperature controlHighMaintain processing temperature within 225–230°C range
Shear controlModerateOptimize screw speed to prevent filler network disruption
CoolingModerateUniform cooling for dimensional stability

Drying Requirement:

DGK-LDPE DD4-5 contains conductive fillers that can be affected by moisture. Proper drying is essential:

Drying temperature: 90°C

Drying time: 4–5 hours

Moisture content target: <0.1%

Film Extrusion:

For blown film extrusion, DGK-LDPE DD4-5 provides:

Good melt strength for bubble stability

Consistent gauge control

Uniform conductivity across the film width

Injection Molding:

For injection molding, DGK-LDPE DD4-5 provides:

Good flow for complex geometries

Low warpage

Consistent part-to-part conductivity

Customer Validation Scenario

Context: A manufacturer of ESD-safe packaging for semiconductor components was producing anti-static bags from a standard LDPE film. The film had surface resistivity of 10⁶–10⁹ Ω/sq — acceptable for general ESD protection but insufficient for the customer's requirements for high-sensitivity components. The customer required surface resistivity below 10⁶ Ω/sq.

Problem analysis:

ParameterExisting MaterialRequirement
Surface Resistivity10⁶–10⁹ Ω/sq<10⁶ Ω/sq
Film Thickness0.05 mm0.05 mm
ApplicationSemiconductor packagingHigh-sensitivity component protection

Root cause: The existing LDPE film used an ionic antistat that provided only moderate static dissipation. For high-sensitivity components, the resistivity was too high to provide adequate protection.

DEYU solution — DGK-LDPE DD4-5:

Surface resistivity of 10³–10⁵ Ω — 10–1,000× lower than the existing material

Permanent conductivity — humidity-independent performance

Excellent film processability — compatible with existing blown film equipment

High elongation (410%) — good tear resistance for bag applications

Trial structure:

ParameterValue
Trial Quantity500 m² of film (5 extrusion runs)
Monthly Production10,000 m²
Target Surface Resistivity<10⁶ Ω/sq
Film Thickness0.05 mm

Validation Data Table (customer internal trial structure):

ParameterExisting Material (Ionic Antistat)DGK-LDPE DD4-5TargetImprovement
Surface Resistivity (Ω/sq)5×10⁸4×10⁵<10⁶1,000× lower
Resistivity at 25% RH (Ω/sq)8×10¹⁰5×10⁵<10⁶Stable (humidity-independent)
Film Tensile Strength (MPa)1618>15Stable
Elongation at Break (%)350410>300Improved
Bag Tear ResistanceGoodGoodGoodStable
Visual QualityGoodExcellentGoodImproved
Extrusion Scrap Rate3%2%<3%Reduced
Validation scene for conductive LDPE film: resistance testing, data-sheet reading and production trial review.
Validation scene for conductive LDPE film: resistance testing, data-sheet reading and production trial review.

Result Interpretation:

Existing material analysis: The ionic antistat LDPE provided marginal ESD protection that varied with humidity. At low humidity, resistivity increased by two orders of magnitude, creating a risk for high-sensitivity components.

DGK-LDPE DD4-5 solution: The carbon black-filled LDPE provided stable, humidity-independent conductivity at 10³–10⁵ Ω — 1,000× lower than the existing material. The film processability was excellent, with improved elongation (410%) and reduced scrap rate. The customer approved the material for full production.

DEYU's contribution: DEYU provided a direct material replacement that delivered the required ultra-low surface resistivity without compromising film properties or processing. The permanent conductivity eliminated humidity-related performance variation.

Next steps: Full production validation across all bag sizes. DEYU can provide ongoing technical support and in-process resistivity monitoring protocols.

Suitable Applications

ApplicationWhy DGK-LDPE DD4-5Key Requirement
ESD bags for ICs, semiconductorsUltra-low resistivity + film processability10³–10⁵ Ω, humidity-independent
Thermoformed ESD traysFormability + conductivity10³–10⁵ Ω, impact resistance
FIBC liners (hazardous powders)Grounding + chemical resistance10³–10⁵ Ω, permanent conductivity
Anti-static packaging filmsStable ESD protection + flexibility10³–10⁵ Ω, high elongation
Cleanroom liners, waste sacksLow particle generation + ESD10³–10⁵ Ω, cleanroom compatibility
Conductive extrusion profilesConductivity + dimensional stability10³–10⁵ Ω, extrusion processability
Injection-molded ESD containersImpact resistance + conductivity10³–10⁵ Ω, toughness
Component carriers (injection molded)Dimensional stability + ESD10³–10⁵ Ω, no break impact

What Buyers Should Provide for Selection

To receive a precise recommendation for DGK-LDPE DD4-5 applications, buyers should provide:

Resistivity requirement — surface or volume resistivity range (Ω/sq or Ω·cm) with test standard

Application description — film, bag, tray, liner, or other?

Processing method — blown film, cast film, extrusion, thermoforming, injection molding

Part geometry — dimensions, wall thickness, stretch ratio (if thermoforming)

Film/sheet thickness — target thickness range

Mechanical requirements — tear strength, puncture resistance, flexibility

Environmental conditions — temperature range, chemical exposure, humidity

Regulatory requirements — RoHS, REACH, food contact, ATEX

Production volume — annual or monthly quantity

Current issues — what problems need solving with the existing material?

DEYU can support with:

Grade selection based on application requirements

Processing parameter recommendations for consistent conductivity

Small-batch validation (25–100 kg) with full electrical and mechanical testing

Technical support during film extrusion and molding trials

In-process quality monitoring protocols

Conclusion

DGK-LDPE DD4-5 is DEYU's high-conductivity LDPE compound engineered for ESD packaging and industrial applications requiring surface resistivity of 10³–10⁵ Ω. Combining LDPE's inherent flexibility, chemical resistance, and processability with stable, permanent carbon-based conductivity, this grade delivers reliable ESD protection for sensitive electronic components, hazardous materials, and cleanroom applications.

Key takeaways:

Ultra-low resistivity — surface resistivity of 10³–10⁵ Ω — 1,000× lower than standard dissipative LDPE

Permanent, humidity-independent conductivity — carbon black network provides stable ESD protection regardless of environmental conditions — unlike ionic antistats that lose effectiveness at low humidity

Excellent mechanical properties — tensile strength of 18 MPa, elongation at break of 410%, and no-break Izod impact — providing the toughness and ductility required for demanding packaging applications

Processing flexibility — compatible with blown film, cast film, extrusion, thermoforming, and injection molding — one grade for multiple manufacturing methods

Lightweight — density of 0.91 g/cm³ — cost-effective shipping and handling

Application-proven — validated in ESD bags, films, trays, liners, and injection-molded components

Not for every application — for applications requiring lower conductivity (10⁶–10⁹ Ω/sq for general ESD), DEYU offers other grades with different resistivity targets

DGK-LDPE DD4-5 is available for small-batch validation and full production orders. DEYU's technical team can provide application-specific guidance, process optimization support, and full test documentation for qualification and validation.

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